Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology

Design and Simulation

,

Éditeur :

Springer

Paru le : 2023-06-01

This book adopts the latest academic achievements of microwave and millimeter-wave chips based on thin-film integrated passive device technology as specific cases. Coherent processes of basic theories and design implementations of microwave and millimeter-wave chips are presented in detail. It forms...
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À propos


Éditeur

Collection
n.c

Parution
2023-06-01

Pages
311 pages

EAN papier
9789819914548

Auteur(s) du livre


Prof. Yongle Wu received his Ph.D. degree in electronic engineering from Beijing University of Posts and Telecommunications (BUPT), China, in 2011. He was a Research Assistant at the City University of Hong Kong (CityU) from April to October 2010. Prof Wu is currently a Professor with the School of Integrated Circuits, BUPT. His research interests include integrated circuits, microwave components, antennas, and wireless systems design.Weimin Wang received the M.S. degree in Electromagnetic Field and Microwave Technology and the Ph. D. degree in Electronic Science and Technology from Beijing University of Posts and Telecommunications (BUPT), in 2004 and 2014 She is currently an Associate Professor in the School of Electronic Engineering, BUPT. Her research interests include electromagnetic field, antennas, microwave circuits and antenna measurement.

Caractéristiques détaillées - droits

EAN PDF
9789819914555
Prix
147,69 €
Nombre pages copiables
3
Nombre pages imprimables
31
Taille du fichier
18258 Ko
EAN EPUB
9789819914555
Prix
147,69 €
Nombre pages copiables
3
Nombre pages imprimables
31
Taille du fichier
67615 Ko

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