Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach

Éditeur :

Springer

Paru le : 2018-03-12

This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design.  Based on the author’s extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips a...
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Éditeur

Collection
n.c

Parution
2018-03-12

Pages
177 pages

EAN papier
9783319757674

Auteur(s) du livre


Farhang Yazdani is the Founder and CEO of BroadPak Corporation. BroadPak is internationally recognized as the “key provider of innovative total solution for 2.5D/3D products”. Through his 18 years with the industry, he has served in various technical, management, and advisory positions with leading semiconductor companies worldwide. He is widely regarded as an expert in 2.5D and 3D integration technologies. He is the recipient of 2013 NIPSIA award in recognition of his contribution to the advancement and innovations in packaging technologies. He has numerous publications and IPs in the area of 2.5D/3D Packaging and Assembly, serves on various technical committees and is a frequent reviewer for IEEE Journal of Advanced Packaging. He received his undergraduate and graduate degrees in Chemical Engineering and Mechanical Engineering from the University of Washington, Seattle.

Caractéristiques détaillées - droits

EAN PDF
9783319757698
Prix
94,94 €
Nombre pages copiables
1
Nombre pages imprimables
17
Taille du fichier
14244 Ko

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