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In August of 2006, an engineering VP from one of Altera’s customers approached Misha Burich, VP of Engineering at Altera, asking for help in reliably being able to predict the cost, schedule and quality of system designs reliant on FPGA designs. At this time, I was...
Editeur :
Springer
Parution :
2010-07-23
ePub
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The Information and communication technology (ICT) industry is said to account for 2% of the worldwide carbon emissions – a fraction that continues to grow with the relentless push for more and more sophisticated computing equipment, c- munications infrastructure, and...
Editeur :
Springer
Parution :
2010-07-23
ePub
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During the last decade many new concepts have been proposed for improving the performance of power MOSFETs. The results of this research are dispersed in the technical literature among journal articles and abstracts of conferences. Consequently, the information is not...
Editeur :
Springer
Parution :
2010-06-26
ePub
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Most of the recent texts on compact modeling are limited to a particular class of semiconductor devices and do not provide comprehensive coverage of the field. Having a single comprehensive reference for the compact models of most commonly used semiconductor devices...
Editeur :
Springer
Parution :
2010-06-22
ePub
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The purpose of this book is to provide a practical approach to managing security in FPGA designs for researchers and practitioners in the electronic design automation (EDA) and FPGA communities, including corporations, industrial and government research labs, and...
Editeur :
Springer
Parution :
2010-06-18
ePub
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Ultra-wideband (UWB), short-pulse (SP) electromagnetics are now being used for an increasingly wide variety of applications, including collision avoidance radar, concealed object detection, and communications. Notable progress in UWB and SP technologies has been...
Editeur :
Springer
Parution :
2010-06-17
ePub
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This book is about formal veri?cation, that is, the use of mathematical reasoning to ensure correct execution of computing systems. With the increasing use of c- puting systems in safety-critical and security-critical applications, it is becoming increasingly important...
Editeur :
Springer
Parution :
2010-06-17
ePub
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The most comprehensive book on state-of-the-art smart card technology available Updated with new international standards and specifications, this essential fourth edition now covers all aspects of smart card in a completely revised structure. Its enlarged coverage...
Editeur :
Wiley
Parution :
2010-05-05
PDF, ePub
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A DEFINITIVE TEXT ON DEVELOPING CIRCUIT SIMULATORS Circuit Simulation gives a clear description of the numerical techniques and algorithms that are part of modern circuit simulators, with a focus on the most commonly used simulation modes: DC analysis and transient...
Editeur :
Wiley-IEEE Press
Parution :
2010-04-07
Collection :
IEEE Press
PDF
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Fundamentals of Power Semiconductor Devices provides an in-depth treatment of the physics of operation of power semiconductor devices that are commonly used by the power electronics industry. Analytical models for explaining the operation of all power semiconductor...
Editeur :
Springer
Parution :
2010-04-02
ePub
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This book is loosely based on a Multidisciplinary University Research Initiative (MURI) project and a few supplemental projects sponsored by the Of?ce of Naval Research (ONR) during the time frame of 2004–2009. The initial technical scope and vision of the MURI project...
Editeur :
Springer
Parution :
2010-03-14
ePub
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Managing the power consumption of circuits and systems is now considered one of the most important challenges for the semiconductor industry. Elaborate power management strategies, such as dynamic voltage scaling, clock gating or power gating techniques, are used today...
Editeur :
Springer
Parution :
2010-03-11
ePub
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Combining analytic theory and modern computer-aided design techniques this volume will enable you to understand and design power transfer networks and amplifiers in next generation radio frequency (RF) and microwave communication systems. A comprehensive theory of...
Editeur :
Wiley
Parution :
2010-02-22
PDF
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In the past decades, the main stream of microelectronics progress has been mainly powered by Moore's law which focuses on IC miniaturization down to nanoscale. While the microelectronics community around the world continues to invent new solutions to keep...
Editeur :
Springer
Parution :
2010-01-23
ePub
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Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated...
Editeur :
Springer
Parution :
2010-01-22
PDF, ePub
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High definition video requires substantial compression in order to be transmitted or stored economically. Advances in video coding standards from MPEG-1, MPEG-2, MPEG-4 to H.264/AVC have provided ever increasing coding efficiency, at the expense of great computational...
Editeur :
Springer
Parution :
2009-12-29
ePub
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Low-power sensors and their applications in various fields ranging from military to civilian lives have made tremendous progress in the recent years.Low-power and extended battery life are the key focuses for long term, reliable and easy operation of these sensors....
Editeur :
Springer
Parution :
2009-12-02
ePub
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In "The gm/ID Methodology, a Sizing Tool for Low-Voltage Analog CMOS Circuits", we compare the semi-empirical to the compact model approach. Small numbers of parameters make the compact model attractive for the model paves the way towards analytic expressions...
Editeur :
Springer
Parution :
2009-12-01
Collection :
Analog Circuits and Signal Processing
ePub
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RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in...
Editeur :
Springer
Parution :
2009-12-01
ePub
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“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented...
Editeur :
Springer
Parution :
2009-10-08
ePub
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