Ebooks de John Lau en PDF et EPUB

1 Livre(s)
Télécharger le livre : Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Xuejun Fan , John Lau
The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on...

Editeur : Springer
Parution : 2025-05-18

PDF, ePub

179,34 €