Ebooks de Joungho Kim en EPUB

1 Livre(s)
Télécharger le livre : Electrical Design of Through Silicon Via
Ajouter à ma liste d'envies
Electrical Design of Through Silicon Via
Joungho Kim , Manho Lee , Jun So Pak
Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of...

Editeur : Springer
Parution : 2014-05-11

ePub

94,94 €