Ebooks de Kim S. Siow en PDF et EPUB

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Télécharger le livre : Die-Attach Materials for High Temperature Applications in Microelectronics Packaging
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Die-Attach Materials for High Temperature Applications in Microelectronics Packaging
Kim S. Siow
This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the...

Editeur : Springer
Parution : 2019-01-29

PDF, ePub

210,99 €