Télécharger le livre :  3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
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An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents...

Editeur : Wiley-IEEE Press
Parution : 2018-03-29
Collection : IEEE Press
PDF, ePub

138,15