Télécharger le livre :  Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
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This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation...

Editeur : Springer
Parution : 2015-10-31
Collection : Springer Theses
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