Télécharger le livre :  Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
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Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished...

Editeur : Wiley-IEEE Press
Parution : 2021-12-01
Collection : IEEE Press
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139,21
Télécharger le livre :  Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
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Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across...

Editeur : Wiley-IEEE Press
Parution : 2019-02-20
Collection : IEEE Press
PDF, ePub

147,65