Ebooks de Steffen Kröhnert en PDF et EPUB

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Télécharger le livre : Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
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Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
Beth Keser , Steffen Kröhnert
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across...

Editeur : Wiley-IEEE Press
Parution : 2019-02-20
Collection : IEEE Press
PDF, ePub

147,65 €