Télécharger le livre :  Wafer Level 3-D ICs Process Technology
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Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry’s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system...

Editeur : Springer
Parution : 2009-06-29
Collection : Integrated Circuits and Systems
ePub

147,69