Télécharger le livre :  Wafer Level 3-D ICs Process Technology
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Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry’s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system...

Editeur : Springer
Parution : 2009-06-29
Collection : Integrated Circuits and Systems
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147,69
Télécharger le livre :  Chemical Mechanical Planarization of Microelectronic Materials
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Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative...

Editeur : Wiley-VCH
Parution : 2008-09-26

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